The progression of semiconductor technology nodes tells not just the story of computing advancement, but also charts the career paths of the engineers who bring these innovations to life. Few narratives better illustrate this symbiotic relationship than that of Jefferson Patz, a lead process integration engineer now working at TSMC’s expanding Arizona facility.
I met Patz during my recent tour of TSMC’s Arizona campus, where the Taiwan-based semiconductor giant is investing over $65 billion to establish leading-edge chip manufacturing in the United States. His career trajectory offers a fascinating window into how semiconductor professionals evolve alongside the technology they help create.
“When I started in this industry fifteen years ago, we were working on 45-nanometer nodes and thought that was incredibly advanced,” Patz told me as we walked through the gleaming clean room facilities. “Now we’re pushing below 3 nanometers, and my technical vocabulary has had to completely transform multiple times throughout my career.”
Patz’s journey began at a time when Moore’s Law—the observation that transistor density doubles roughly every two years—still seemed an unshakeable industry constant. He joined the semiconductor industry after completing his materials science doctorate at Stanford, initially working on what now seems like ancient technology: 45nm process nodes.
According to research from the Semiconductor Industry Association, each technology node advancement typically requires approximately 5-7 years of development before reaching mass production. This rhythm has defined career advancement for engineers like Patz, who must continuously reinvent their expertise.
“Each node shrink isn’t just making things smaller,” Patz explained. “We’re dealing with completely different physics challenges at each step. At 7nm, we transitioned to EUV lithography. At 5nm, we had to manage new quantum tunneling effects. The problems keep changing, which keeps the work fascinating.”
The migration of semiconductor talent has become a critical industry story. As TSMC builds out its Arizona operation, it faces the dual challenge of transferring institutional knowledge from Taiwan while developing American engineering talent. This balance represents both a technical and cultural challenge.
What makes Patz’s role particularly valuable is his experience working across multiple nodes. According to industry analyst firm TrendForce, engineers with multi-node experience command approximately 30% higher compensation, reflecting their ability to bridge different engineering approaches and anticipate challenges in scaling technologies.
“The biggest misconception about our work is that we’re just following a predetermined path of miniaturization,” Patz noted. “In reality, each node requires fundamentally new materials, new processes, sometimes completely rethinking chip architecture.”
TSMC’s Arizona plant represents more than just American manufacturing capability—it’s becoming a crucial training ground for U.S. semiconductor talent. The company reportedly plans to send hundreds of American engineers to Taiwan for training before returning to staff the Arizona facilities, creating knowledge transfer that strengthens the global semiconductor ecosystem.
The semiconductor industry faces significant workforce challenges. A 2023 report from the Semiconductor Industry Association indicates the U.S. needs approximately 67,000 additional workers by 2030 to support domestic chip manufacturing growth—professionals who understand not just current technology but how to advance to future nodes.
“When I explain my job to friends outside the industry, I tell them I’m part physicist, part chemist, part materials scientist, and increasingly, part data scientist,” Patz said. “The integration of AI into our manufacturing processes means my role keeps expanding into new domains.”
For young engineers considering this career path, Patz emphasizes fundamental scientific understanding over specific process knowledge. “The specific techniques we use today might be obsolete in five years, but understanding the underlying physical and chemical principles never goes out of style.”
TSMC’s Arizona expansion represents one of the most significant onshoring efforts in U.S. manufacturing history. When fully operational, the facility will produce approximately 600,000 wafers annually, creating chips for everything from smartphones to critical defense applications.
As I concluded my conversation with Patz, I asked what keeps him engaged after fifteen years of node-hopping across the semiconductor landscape. His answer was surprisingly philosophical.
“We’re working at the absolute edge of what’s physically possible,” he said. “There’s something profound about manipulating matter at near-atomic scales to create the computational foundation for modern society. Every process challenge we solve helps advance everything from medical research to climate modeling. That sense of purpose doesn’t diminish with time.”
For the semiconductor industry and its engineers, the path forward remains both challenging and essential. As technology nodes continue to advance, they’ll bring with them not just more powerful computing, but new generations of engineering expertise—careers defined by the constant pursuit of the seemingly impossible.
